Dislocations, texture and stress development in hydrogen-cycled Pd thin films: An in-situ X-ray diffraction study

For Pd thin films, microstructural changes involved during hydrogen cycling provide the information needed to predict and optimize film's mechanical strength. In this paper, a systematic study of morphology, microstructure, texture, stress has been performed on films loading deloading cycles at room temperature. similar morphology were prepared by magnetron sputtering substrates different compliances, i.e., Si-oxide, Titanium (Ti) Polyimide (PI). The evolution grain-orientation distribution (texture), state stress, dislocation densities are analyzed for each film substrate types 20 loading/deloading cycles. lattice expansion contraction caused transition from Pd-hydride back result in strong increase. This increase stabilizes after few grain boundary motion that leads gradual enhancement (111) texture density strongly clamped an oxidized Si(100) wafer with intermediate layer (Ti or PI). PI, is also partly released crack-based (crack widening/growth/propagation) pathway. Ti PI do not buckle blister By providing sufficiently compliant traditional problems buckle-delamination stiff mitigated.